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 EN5337QI
3A Voltage Mode Synchronous Buck PWM DC-DC Converter with Integrated Inductor
Description
The EN5337QI is a Power Supply on a Chip (PwrSoC) DC-DC converter. It integrates MOSFET switches, all small-signal circuits, compensation, and the inductor in an advanced 4mm x 7mm QFN package. The EN5337QI is specifically designed to meet the precise voltage and fast transient requirements of present and future highperformance, low-power processor, DSP, FPGA, memory boards, and system level applications in distributed power architectures. Advanced circuit techniques, ultra high switching frequency, and very advanced, high-density, integrated circuit and proprietary inductor technology deliver highquality, ultra compact, non-isolated DC-DC conversion. The Enpirion solution significantly helps in system design and productivity by offering greatly simplified board design, layout and manufacturing requirements. In addition, a reduction in the number of vendors required for the complete power solution helps to enable an overall system cost savings. All Enpirion products are RoHS compliant and lead-free manufacturing environment compatible.
Features
* * * * * * * * * * * * * * * * * Integrated Inductor, MOSFETS, Controller Total Power Solution 75mm2 Minimal external components. 3A Continuous Output Current Capability 5MHz operating frequency. Switching frequency can be phase locked to an external clock. High efficiency, up to 92%. Wide input voltage range of 2.375V to 5.5V. Output Enable pin and Power OK signal. Programmable soft-start time. Under Voltage Lockout, Over Current, Short Circuit and Thermal Protection. RoHS compliant, MSL level 3, 260C reflow. Point of load regulation for low-power processors, network processors, DSPs, FPGAs, and ASICs Noise sensitive applications such as A/V, RF and Gbit I/O Low voltage, distributed power architectures with 2.5V, 3.3V or 5V rails Computing, Networking, DSL, STB, DVR, DTV, iPC Ripple sensitive applications Beat frequency sensitive applications
VIN VOUT
Applications
RA 0402 CA 0402
RB 0402
0402 Soft Start Cap
EN5337QI
EN5337QI
22F
1206
PVIN ENA AVIN PGND
VOUT RA XFB PGND RB CA
47F
1206
Output Cap 47uF/1206
Input Cap 22uF/1206
SS
AGND
Figure 1: Total Solution Footprint (Not to scale) Total Area 75 mm2
Figure 2: Typical Application Schematic www.enpirion.com
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Ordering Information
Temp Rating Package (C) -40 to +85 38-pin QFN T&R QFN Evaluation Board
Pin Assignments (Top View)
ENABLE
27
NC(SW)
NC(SW)
NC(SW)
NC(SW)
NC(SW)
EAOUT
AGND
Part Number EN5337QI-T EN5337QI-E
38
37
36
35
34
33
32
31
30
29
28
NC(SW) NC(SW) NC NC VOUT VOUT
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
SYNC
26 25 24
AVIN
POK
XFB
SS
NC NC NC NC PVIN PVIN
EN5337QI
23 22 21 20
VOUT
VOUT
VOUT
VOUT
VOUT
PGND
PGND
PGND
PGND
PGND
Figure 3: Pinout Diagram (Top View) NOTE: All perimeter pins must be soldered to PCB.
Pin Description
PIN
1-2, 12, 34-38 3-4, 22-25 5-11 13-18 19-21 26 27 28 29 30 31 32 33
NAME
NC(SW) NC VOUT PGND PVIN SYNC ENABLE POK EAOUT SS XFB AGND AVIN
FUNCTION
NO CONNECT - These pins are internally connected to the common switching node of the internal MOSFETs. They are not to be electrically connected to any external signal, ground, or voltage. Failure to follow this guideline may result in damage to the device. NO CONNECT - These pins may be internally connected. Do not connect them to each other or to any other electrical signal. Failure to follow this guideline may result in device damage. Regulated converter output. Connect these pins to the load, and place output capacitor from these pins and PGND pins 13-15 Input/Output power ground. Connect these pins to the ground electrode of the Input and output filter capacitors. See VOUT and PVIN pin descriptions for more details. Input power supply. Connect to input power supply. Decouple with input capacitor to PGND pins 16-18. External Clock Input to synchronize internal switching clock to an external signal Input Enable. Applying logic high enables the output and initiates a soft-start. Applying a logic low disables the output. Power OK is an open drain transistor for power system state indication. POK will be logic high when VOUT is with -10% to +20% of VOUT nominal. Optional Error Amplifier output. Allows for customization of the control loop response. Soft-Start node. The soft-start capacitor is connected between this pin and AGND. The value of this capacitor determines the startup time. External Feedback Input. The feedback loop is closed through this pin. A voltage divider at VOUT is used to set the output voltage. The mid point of the divider is connected to XFB. A phase lead capacitor from this pin to VOUT is also required to stabilize the loop. Analog Ground. This is the Ground return for the controller. Needs to be connected to a quiet ground. Input power supply for the controller. Needs to be connected to input voltage at a quiet point.
NC(SW)
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PGND
PVIN
EN5337QI
Absolute Maximum Ratings
CAUTION: Absolute Maximum ratings are stress ratings only. Functional operation beyond the recommended operating conditions is not implied. Stress beyond the absolute maximum ratings may impair device life. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. PARAMETER
Voltages on PVIN, AVIN, VOUT Voltages on Enable, POK Voltages on XFB, EAOUT, SYNC, SS Storage Temperature Range Maximum Operating Junction Temperature Reflow Temp, 10 Sec, MSL3 JEDEC J-STD-020A ESD Rating - User pins (based on HBM) ESD Rating - NC pins (based on HBM) ESD Rating (based on CDM) TSTG TJ-ABS Max
SYMBOL
VIN
MIN
-0.5 -0.5 -0.5 -65
MAX
6.0 VIN 2.5 150 150 260 2000 1000 500
UNITS
V V V C C C V V V
Recommended Operating Conditions
PARAMETER
Input Voltage Range Output Voltage Range Output Current Operating Junction Temperature
SYMBOL
VIN VOUT ILOAD TJ-OP
MIN
2.375 0.60 0 - 40
MAX
5.5 VIN - VDO 3 125
UNIT S
V V A C
Operating Ambient Temperature TAMB - 40 85 C VDO (drop-out voltage) is defined as (ILOAD x Dropout Resistance). Please see Electrical Characteristics table.
Thermal Characteristics
PARAMETER
Thermal Shutdown Thermal Shutdown Hysteresis Thermal Resistance: Junction to Ambient (Note 1) Thermal Resistance: Junction to Case
SYMBOL
TSD TSDH JA JC
MIN
TYP
150 20 30 3
MAX
UNITS
C C C/W C/W
Note 1: Based on a four layer copper board and proper thermal design in line with JEDEC EIJ/JESD51 standards
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EN5337QI
Electrical Characteristics
NOTE: VIN=5.5V over operating temperature range unless otherwise noted. Typical values are at TA = 25C.
PARAMETER
Operating Input Voltage Under Voltage Lock-out - VIN Rising Under Voltage Lock-out - VIN Falling Shut-Down Supply Current Feedback Pin Voltage Feedback pin Input Leakage Current 1 Line Regulation Load Regulation Temperature Regulation VOUT Rise Time Rise Time Accuracy 1 Output Drop Out Voltage Resistance 1 Maximum Continuous Output Current Over Current Trip Level Disable Threshold ENABLE Threshold ENABLE Lock-out time ENABLE pin Input Current1 Switching Frequency (Free Running) External SYNC Clock Frequency Lock Range SYNC Input Threshold - Low SYNC Input Threshold - High
POK Threshold POK Output Low Voltage POK Output Hi Voltage POK pin VOH Leakage 1 Current
SYMBOL
VIN VUVLOR VUVLOF IS VXFB IXFB VOUT_LINE VOUT_LOAD VOUT_TEMP tRISE TRISE VDO RDO IOUT_Max_Cont IOCP VDISABLE VENABLE TENLO IENABLE FSW FPLL_LOCK VSYNC_LO VSYNC_HI
POKTH VPOKL VPOKH IPOKL
TEST CONDITIONS
Voltage above which UVLO is not asserted Voltage below which UVLO is asserted ENABLE=0V Feedback node voltage - factory setting - TA = 25C XFB pin input leakage current 2.375V VIN 5.5V 0A ILOAD 3A -40C TEMP 85C Measured from when VIN VUVLOR & ENABLE pin voltage crosses logic high threshold. (4.7nF CSS 100nF) 4.7nF CSS 100nF VINMIN - VOUT at Full load Input to Output Resistance
MIN
2.375
TYP
2.2 2.1 100
MAX
5.5
UNITS
V V V A
0.735 -5
0.75
0.765 5
V nA %/V %/A %/C
0.02 -0.03 0.003 CSS X 67 k -25 250 83 3 4.5 +25 500 167
% mV m A A
ENABLE pin logic low. ENABLE pin logic high 2.375V VIN 5.5V Time for device to re-enable after a falling edge on ENABLE pin ENABLE pin has ~80k pull down Free Running frequency of oscillator Range of SYNC clock frequency SYNC Clock Logic Level SYNC Clock Logic Level
Output voltage as a fraction of expected output voltage With 4mA current sink into POK 2.375V VIN 5.5V POK high
0.0 1.8 700
0.8 VIN
V V S
70 5 4.5 5.5 0.8 1.8
90 0.4 VIN 1
A MHz MHz V V
% V V A
2.5
Note 1: Parameter guaranteed by design (c)Enpirion 2009 all rights reserved, E&OE
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Typical Performance Characteristics
90 80 Efficiency (%) 70 60 50 40 30 20 VIN = 5V
90 80 Efficiency (%) 70 60 50 40 30 0 0.5 1 1.5 Load (Amps) 2 2.5 3 VIN = 3.3V
0
0.5
1
1.5 Load (Amps)
2
2.5
3
Efficiency VIN = 3.3V VOUT (From top to bottom) = 2.5, 1.8, 1.2, 1.0, 0.75V
Efficiency VIN = 5.0V VOUT (From top to bottom) = 3.3, 2.5, 1.8, 1.2, 1.0, 0.75V
20 MHz BW limit
500 MHz BW
Output Ripple: VIN = 3.3V, VOUT = 1.2V, Iout = 3A CIN = 22F, COUT = 47F/1206 + 10uF/0805
Output Ripple: VIN = 3.3V, VOUT = 1.2V, Iout = 3A CIN = 22F, COUT = 47F/1206 + 10uF/0805
20 MHz BW limit
500 MHz BW
Output Ripple: VIN = 5V, VOUT = 1.2V, Iout = 3A CIN = 22F, COUT = 47F/1206 + 10uF/0805
Output Ripple: VIN = 5V, VOUT = 1.2V, Iout = 3A CIN = 22F, COUT = 47F/1206 + 10uF/0805
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Load Transient: VIN = 5.0V, VOUT = 1.2V Ch.1: VOUT, Ch.4: ILOAD (slew rate 10A/S) CIN = 22F, COUT 50F
Load Transient: VIN = 3.3V, VOUT = 1.2V Ch.1: VOUT, Ch.4: ILOAD (slew rate 10A/S) CIN = 22F, COUT 50F
Power Up/Down at No Load: VIN/VOUT = 5.0V/1.2V, 15nF soft-start capacitor, Ch.1: ENABLE, Ch.3: VOUT, Ch.4; POK
0.300
Power Up/Down into 0.4 load: VIN/VOUT = 5.0V/1.2V, 15nF soft-start capacitor, Ch.1: ENABLE, Ch.3: VOUT, Ch.4; POK
0.250
VDO (VINMIN - VOUT)
0.200
0.150
0.100
0.050
0.000
0
0.5
1
1.5 Load (Amps)
2
2.5
3
Drop-Out Voltage
Enable Lock-out Time, Ch.1: ENABLE, Ch. 2: VOUT 6
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(c)Enpirion 2009 all rights reserved, E&OE
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Rev:D
EN5337QI
Functional Block Diagram
PVIN
UVLO Thermal Limit Current Limit
EN5337QI
Over Voltage P-Drive
NC(SW)
VOUT (-) PWM Comp (+) N-Drive PGND
SYNC
PLL / Sawtooth Generator
Compensation Network
(-) EAOUT Error Amp (+) power Good Logic
XFB
ENABLE
POK
AVIN SS Soft Start Voltage Reference Regulated Voltage
EAOUT
AGND
Figure 4: Functional Block Diagram
Functional Description
Synchronous Buck Converter
The EN5337QI is a synchronous, programmable power supply with integrated power MOSFET switches and integrated inductor. The nominal input voltage range is 2.375V to 5.5V. The output voltage is programmed using an external resistor divider network. The control loop is voltage-mode with a type III compensation network. Much of the compensation circuitry is internal to the device. However, a phase lead capacitor is required along with the output voltage feedback resistor divider to complete the type III compensation network. The device uses a low-noise PWM topology. Up to 3A of continuous output current can be drawn from this converter. The 5MHz switching frequency allows the use of small size input / output capacitors, and realizes a wide loop bandwidth within a small foot print.
(c)Enpirion 2009 all rights reserved, E&OE
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Protection Features:
The power supply has the following protection features: * Over-current protection (to protect the IC from excessive load current) * Thermal shutdown with hysteresis. * Under-voltage lockout circuit to disable the converter output when the input voltage is less than approximately 2.2V
Additional Features:
* * The switching frequency can be phaselocked to an external clock to eliminate or move beat frequency tones out of band. Soft-start circuit, limiting the in-rush current when the converter is initially powered up. The soft start time is programmable with appropriate choice of soft start capacitor value. www.enpirion.com
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EN5337QI * Power good circuit indicating the output voltage is between 90% and 120% of programmed value as long as the feedback loop is closed. Rise Time: TR (Css* 67k) 25% During start-up of the converter, the reference voltage to the error amplifier is linearly increased to its final level by an internal current source of approximately 10uA. The soft start capacitor should be between 4.7nF and 100nf. Typical soft-start rise time is ~1mS with SS capacitor value of 15nF. The rise time is measured from when VIN VUVLOR and ENABLE pin voltage crosses its logic high threshold to when VOUT reaches its programmed value.
Enable Operation
The ENABLE pin provides a means to enable normal operation or to shut down the device. Applying logic high will enable the converter into normal operation. When the ENABLE pin is asserted (high) the device will undergo a normal soft start. A logic low will disable the converter. A logic low will power down the device in a controlled manner and the device is subsequently shut down. The device will remain shut-down for the duration of the ENABLE lockout time (see Electrical Characteristics Table). If the ENABLE signal is re-asserted during this time, the device will power up with a normal soft-start at the end of the ENABLE lockout time.
POK Operation
The POK signal is an open drain signal (requires a pull up resistor to VIN or similar voltage) from the converter indicating the output voltage is within the specified range. The POK signal will be logic high (VIN) when the output voltage is above 90% of programmed VOUT. If the output voltage goes below this threshold, the POK signal will be at logic low.
Frequency Synchronization
The switching frequency of the DC/DC converter can be phase-locked to an external clock source to move unwanted beat frequencies out of band. To avail this feature, the clock source should be connected to the SYNC pin. An activity detector recognizes the presence of an external clock signal and automatically phase-locks the internal oscillator to this external clock. Phase-lock will occur as long as the input clock frequency is in the range of 4.5 to 5.5 MHz. When no clock signal is present, the device reverts to the free running frequency of the internal oscillator.
Over-Current Protection
The current limit function is achieved by sensing the current flowing through the Power PFET. When the sensed current exceeds the over current trip point, both power FETs are turned off for the remainder of the switching cycle. If the over-current condition is removed, the over-current protection circuit will enable normal PWM operation. If the over-current condition persists, the soft start capacitor will gradually discharge causing the output voltage to fall. When the OCP fault is removed, the output voltage will ramp back up to the desired voltage. This circuit is designed to provide high noise immunity.
Spread Spectrum Mode
The external clock frequency may be swept between 4.5 MHz and 5.5 MHz at repetition rates of up to 10 kHz in order to reduce EMI frequency components.
Thermal Overload Protection
Thermal shutdown circuit will disable device operation when the Junction temperature exceeds approximately 150C. After a thermal shutdown event, when the junction temperature drops by approx 20C, the converter will re-start with a normal soft-start.
Soft-Start Operation
Soft start is a means to reduce the in-rush current when the device is enabled. The output voltage is ramped up gradually upon start-up. The output rise time is controlled by the choice of soft-start capacitor, which is placed between the SS pin (pin 30) and the AGND pin (pin 32).
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EN5337QI
Input Under-Voltage Lock-Out
Internal circuits ensure that the converter will not start switching until the input voltage is above the specified minimum voltage. Hysteresis, input de-glitch, and output leading edge blanking ensure high noise immunity and prevent false UVLO triggers.
Compensation
The EN5337QI uses a type 3 compensation network. A piece of the compensation circuit is the phase lead capacitor CA in Figure 5. This network will provide wide loop bandwidth and
excellent transient performance for most applications. It is optimized for use with about 50F of output filter capacitance at the voltage sensing point. Additional load decoupling capacitance may be placed beyond the voltage sensing point outside the control loop. Voltage mode operation provides high noise immunity at light load, and low output impedance. In some applications modifications to the compensation may be required. For more information, contact Enpirion Applications Engineering support.
Application Information
The EN5337QI output voltage is determined by the voltage presented at the XFB pin. This voltage is set by way of a resistor divider between VOUT and AGND with the midpoint going to XFB. A phase lead capacitor CA is also required for stabilizing the loop. Figure 5 shows the required components and the equations to calculate the values.
VOUT RA CA XFB RB RA = 150 k , CA = 22 pF RB = 0.75 * RA (VOUT - 0.75V )
some applications, lower value capacitors are needed in parallel with the larger, capacitors in order to provide high frequency decoupling.
Recommended Input Capacitors
Description
10uF, 10V, 10% X7R, 1206 (1-2 capacitors needed) 22uF, 10V, 20% X5R, 1206 (1 capacitor needed)
MFG
Murata Taiyo Yuden Murata Taiyo Yuden
P/N
GRM31CR71A106KA01L LMK316B7106KL-T GRM31CR61A226ME19L LMK316BJ226ML-T
Output Capacitor Selection
The EN5337QI has been optimized for use with approximately 50F of output filter capacitance at the voltage sensing point Additional load decoupling capacitance may be placed beyond the voltage sensing point outside the control loop. Low ESR ceramic capacitors are required with X5R or X7R rated dielectric formulation. Y5V or equivalent dielectric formulations must not be used as these lose too much capacitance with frequency, temperature and bias voltage. Output ripple voltage is determined by the aggregate output capacitor impedance. Output impedance, denoted as Z, is comprised of effective series resistance, ESR, and effective series inductance, ESL: Z = ESR + ESL Placing output capacitors in parallel reduces the impedance and will hence result in lower
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Figure 5: VOUT Resistor Divider Network and Compensation Capacitor CA
Input Capacitor Selection
The EN5337QI requires between 10uF and 20uF of input capacitance. Low-cost, low-ESR ceramic capacitors should be used as input capacitors for this converter. The dielectric must be X5R or X7R rated. Y5V or equivalent dielectric formulations must not be used as these lose too much capacitance with frequency, temperature and bias voltage. In
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EN5337QI ripple voltage.
1 Z Total
=
1 1 1 + + ... + Z1 Z 2 Zn
Recommended Output Capacitors
Description
47uF, 6.3V, 20% X5R, 1206 (1 capacitor needed) 10uF, 6.3V, 10% X5R, 0805 (Optional 1 capacitor in parallel with 47uF above)
MFG
Murata Taiyo Yuden Murata Taiyo Yuden
P/N
GRM31CR60J476ME19L JMK212BJ476ML-T GRM21BR60J106KE19L JMK212BJ106KG-T
Typical Ripple Voltages
Output Capacitor Configuration 1 x 47 uF 47 uF + 10 uF Typical Output Ripple (mVp-p) (as measured on EN5335QI Evaluation Board) 30 15
Power-Up Sequencing
During power-up, ENABLE should not be asserted before PVIN, and PVIN should not be asserted before AVIN. Tying all three pins together meets these requirements.
Thermal Considerations
The Enpirion EN5337QI DC-DC converter is packaged in a 7 x 4 x 1.85mm 38-pin QFN package. The QFN package is constructed with copper lead frames that have exposed thermal pads. The recommended maximum junction temperature for continuous operation is 125C. Continuous operation above 125C will reduce long-term reliability. The device has a thermal overload protection circuit designed to shut it off at an approximate junction temperature value of 150C. The silicon is mounted on a copper thermal pad that is exposed at the bottom of the package. The thermal resistance from the silicon to the exposed thermal pad is very low. In order to take advantage of this low resistance, the exposed thermal pad on the package should be soldered directly on to a copper ground pad on the printed circuit board (PCB). The PCB then acts as a heat sink. In order for the PCB to be an effective heat sink, the device thermal pad should be coupled to copper ground planes or special heat sink structures designed into the PCB (refer to the recommendations at the end of this note). The junction temperature, TJ, is calculated from the ambient temperature, TA, the device power dissipation, PD, and the device junction-toambient thermal resistance, JA in C/W:: TJ = TA + (PD)(JA)
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The junction temperature, TJ, can also be expressed in terms of the device case temperature, TC, and the device junction-tocase thermal resistance, JC in C/W, as follows: TJ = TC + (PD)(JC) The device case temperature, TC, is the temperature at the center of the exposed thermal pad at the bottom of the package. The device junction-to-ambient and junction-tocase thermal resistances, JA and JC, are shown in the Thermal Characteristics table on page 3. The JC is a function of the device and the 38-pin QFN package design. The JA is a function of JC and the user's system design parameters that include the thermal effectiveness of the customer PCB and airflow. The JA value shown in the Thermal Characteristics table on page 3 is for free convection with the device heat sunk (through the thermal pad) to a copper plated four-layer PC board with a full ground and a full power plane following JEDEC EIJ/JESD 51 Standards. The JA can be reduced with the use of forced air convection. Because of the strong dependence on the thermal effectiveness of the PCB and the system design, the actual JA value will be a function of the specific application. www.enpirion.com
Rev:D
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EN5337QI
Design Considerations
Exposed Metal on Bottom of Package
Lead frames offers many advantages in thermal performance, in reduced electrical lead resistance, and in overall foot print. However, they do require some special considerations. In the assembly process lead frame construction requires that, for mechanical support, some of the lead-frame cantilevers be exposed at the point where wire-bond or internal passives are attached. This results in several small pads being exposed on the bottom of the package. Only the large thermal pad and the perimeter pads are to be mechanically or electrically connected to the PC board. The PCB top layer under the EN5337QI should be clear of any metal except for the large thermal pad and the perimeter pads. The "grayed-out" area in Figure 6 represents the area that should be clear of any metal (traces, vias, or planes), on the top layer of the PCB.
Figure 6: Lead-Frame Exposed Metal (package bottom view). Grey area highlights exposed metal below which there should not be any metal (traces, vias, or planes) on the top layer of PCB.
Recommended PCB Footprint
Figure 7: EN5337QI Package PCB Footprint (c)Enpirion 2009 all rights reserved, E&OE
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EN5337QI
Package and Mechanical
Figure 8: EN5337QI Package Dimensions
Contact Information
Enpirion, Inc. Perryville III 53 Frontage Road, Suite 210 Hampton, NJ 08827 USA Phone: +1-908-894-6000 Fax: +1-908-894-6090 www.enpirion.com
Enpirion reserves the right to make changes in circuit design and/or specifications at any time without notice. Information furnished by Enpirion is believed to be accurate and reliable. Enpirion assumes no responsibility for its use or for infringement of patents or other third party rights, which may result from its use. Enpirion products are not authorized for use in nuclear control systems, as critical components in life support systems or equipment used in hazardous environment without the express written authority from Enpirion.
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Rev:D


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